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Didier Chicot
ORCID
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
High Density
Condition Monitoring
Reliability Analysis
Top Venues
Microelectron. Reliab.
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Publications
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Didier Chicot
,
K. Tilkin
,
K. Jankowski
,
Artur Wymyslowski
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique.
Microelectron. Reliab.
53 (5) (2013)