Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Cadmus A. YuanWillem D. van DrielRichard B. R. van SilfhoutOlaf van der SluisRoy A. B. EngelenLeo J. ErnstFred van KeulenG. Q. ZhangPublished in: Microelectron. Reliab. (2006)