R. M. J. Voncken

Publication Activity (10 Years)

Years Active: 2007-2007
Publications (10 Years): 0

Publications

M. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47 (2-3) (2007)