R. A. B. Engelen

Publication Activity (10 Years)

Years Active: 2007-2009
Publications (10 Years): 0

Publications

Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. 49 (8) (2009)
Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectron. Reliab. 47 (12) (2007)