• search
    search
  • reviewers
    reviewers
  • feeds
    feeds
  • assignments
    assignments
  • settings
  • logout

Numerical modeling of warpage induced in QFN array molding process.

Dao-Guo YangKaspar M. B. JansenLeo J. ErnstG. Q. ZhangW. D. van DrielH. J. L. BressersJ. H. J. Janssen
Published in: Microelectron. Reliab. (2007)
Keyphrases