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Measuring the through-plane elastic modulus of thin polymer films in situ.
M. van Soestbergen
Leo J. Ernst
Kaspar M. B. Jansen
W. D. van Driel
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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grain size
piecewise planar
three dimensional
endpoints
ground plane
free space
blind equalization algorithm