M. van Kleef

Publication Activity (10 Years)

Years Active: 2003-2007
Publications (10 Years): 0

Publications

Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47 (9-11) (2007)
N. Duan, J. Scheer, J. Bielen, M. van Kleef
The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. Microelectron. Reliab. 43 (8) (2003)