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Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach.
Dao-Guo Yang
J. S. Liang
Quan-Yong Li
Leo J. Ernst
G. Q. Zhang
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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experimental study
artificial intelligence
uncertain data
database
bayesian networks
data structure
low cost
empirical studies
generative model
simulation study