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Minghui Yun
ORCID
Publication Activity (10 Years)
Years Active: 2019-2024
Publications (10 Years): 3
Top Topics
Finite Element Model
Modeling Method
Mechanical Properties
High Temperature
Top Venues
IEEE Access
IEEE Trans. Instrum. Meas.
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Publications
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Hengjian He
,
Miao Cai
,
Minghui Yun
,
Hao Chen
,
Huanhuan Wang
,
Dao-Guo Yang
Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization.
IEEE Trans. Instrum. Meas.
73 (2024)
Miao Cai
,
Yonghu Liang
,
Minghui Yun
,
Xuan-You Chen
,
Haidong Yan
,
Zhaozhe Yu
,
Dao-Guo Yang
,
Guoqi Zhang
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs.
IEEE Access
7 (2019)
Miao Cai
,
Zhi Liang
,
Kunmiao Tian
,
Minghui Yun
,
Ping Zhang
,
Dao-Guo Yang
,
Guoqi Zhang
Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method.
IEEE Access
7 (2019)