Fenglian Sun

Publication Activity (10 Years)

Years Active: 2008-2018
Publications (10 Years): 2

Top Topics

Programmable Logic

Top Venues

Microelectron. Reliab.

Publications

Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang
A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectron. Reliab. 81 (2018)
Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. Microelectron. Reliab. 55 (8) (2015)
Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo
Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectron. Reliab. 54 (9-10) (2014)
Yang Liu, Fenglian Sun, Hongwu Zhang, J. Wang, Zhen Zhou
Evaluating board level solder interconnects reliability using vibration test methods. Microelectron. Reliab. 54 (9-10) (2014)
Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48 (8-9) (2008)