Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
Fenglian SunHendrik Pieter HochstenbachWillem D. van DrielG. Q. (Kouchi) ZhangPublished in: Microelectron. Reliab. (2008)
Keyphrases
- image analysis
- global optimization
- x ray images
- mathematical morphology
- real time
- low energy
- electron microscopy
- selection mechanism
- facial expression recognition
- x ray
- case study
- genetic algorithm
- access control
- video sequences
- information systems
- process control
- learning mechanism
- learning algorithm
- morphological analysis
- database
- mechanical properties