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Thermal and mechanical effects of voids within flip chip soldering in LED packages.

Yang LiuStanley Y. Y. LeungJia ZhaoCell K. Y. WongCadmus A. YuanGuoqi ZhangFenglian SunLiangliang Luo
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • solder ball connect
  • low cost
  • infrared
  • database
  • physical design
  • analog vlsi
  • learning algorithm
  • database systems
  • high speed
  • power plant
  • single chip
  • programmable logic
  • modular design