Login / Signup
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes.
Yang Liu
Fenglian Sun
Hao Zhang
Tong Xin
Cadmus A. Yuan
Guoqi Zhang
Published in:
Microelectron. Reliab. (2015)
Keyphrases
</>
data analysis
viewpoint
information systems
low cost
high speed
data sets
video sequences
image analysis
control system
statistical analysis
content analysis
single chip