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Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.

Jeroen J. M. ZaalHendrik Pieter HochstenbachWillem D. van DrielG. Q. Zhang
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • high speed
  • loading conditions
  • failure rate
  • low power
  • operating conditions
  • real time
  • frame rate
  • material properties
  • neural network
  • input output