Klaus Pressel

Publication Activity (10 Years)

Years Active: 1999-2021
Publications (10 Years): 3

Top Topics

Information Technology

Highly Reliable

Top Venues

Microelectron. Reliab.

Publications

Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0). DSD (2021)
Klaus Pressel, Andreas Grassmann, Markus Fink, Guenter Tutsch
I. Double-Sided Cooling Technology for Emobility. ESSDERC (2019)
Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, Bernhard Wunderle
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. Microelectron. Reliab. 74 (2017)
R. Plieninger, M. Dittes, Klaus Pressel
Modern IC packaging trends and their reliability implications. Microelectron. Reliab. 46 (9-11) (2006)
Günter Grau, Ulrich Langmann, Wolfgang Winkler, Dieter Knoll, Jörg Osten, Klaus Pressel
A current-folded up-conversion mixer and VCO with center-tapped inductor in a SiGe-HBT technology for 5-GHz wireless LAN applications. IEEE J. Solid State Circuits 35 (9) (2000)
Wolfgang Winkler, Johannes Borngräber, Heide Erzgraeber, Ha. Erzgraber, Bernd Heinemann, Dieter Knoll, H. Jörg Osten, Michael Pierschel, Klaus Pressel, Peter Schley
Wireless communication integrated circuits with CMOS-compatible SiGe HBT technology modules. CICC (1999)