Sven Rzepka

Publication Activity (10 Years)

Years Active: 2004-2023
Publications (10 Years): 7

Top Topics

Histogram Analysis

High Spatial Resolution

Knowledge Retrieval

Top Venues

Microelectron. Reliab.

Publications

Giovanni Di Nuzzo, Horst Lewitschnig, Marc Tuellmann, Sven Rzepka, Alexander Otto
A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters. ICPHM (2023)
Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0). DSD (2021)
Daniel Monteiro Diniz Reis, Sven Rzepka, Karla Hiller
Reliability testing of integrated low-temperature PVD PZT films. Microelectron. Reliab. (2018)
Rainer Dudek, M. Hildebrand, Sven Rzepka, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. Microelectron. Reliab. 83 (2018)
Jürgen Auersperg, Ellen Auerswald, C. Collet, Th. Dean, Dietmar Vogel, Th. Winkler, Sven Rzepka
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. Microelectron. Reliab. 87 (2018)
Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages. Microelectron. Reliab. 62 (2016)
Dietmar Vogel, Ellen Auerswald, Gh. Gadhiya, Sven Rzepka
Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments. Microelectron. Reliab. 64 (2016)
F. Schindler-Saefkow, F. Rost, A. Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, J. Keller
Stress impact of moisture diffusion measured with the stress chip. Microelectron. Reliab. 54 (6-7) (2014)
Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel
Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectron. Reliab. 54 (9-10) (2014)
Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54 (6-7) (2014)
J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53 (9-11) (2013)
Steffen Wiese, Sven Rzepka
Time-independent elastic-plastic behaviour of solder materials. Microelectron. Reliab. 44 (12) (2004)