Jürgen Auersperg

Publication Activity (10 Years)

Years Active: 2014-2018
Publications (10 Years): 2

Top Topics

High Spatial Resolution

Risk Management

Top Venues

Microelectron. Reliab.

Publications

Jürgen Auersperg, Ellen Auerswald, C. Collet, Th. Dean, Dietmar Vogel, Th. Winkler, Sven Rzepka
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. Microelectron. Reliab. 87 (2018)
Jürgen Auersperg, C. Collet, Th. Dean, Dietmar Vogel, Th. Winkler
Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor. Microelectron. Reliab. 64 (2016)
Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel
Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectron. Reliab. 54 (9-10) (2014)
Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54 (6-7) (2014)