Bernd Michel

Publication Activity (10 Years)

Years Active: 2001-2014
Publications (10 Years): 0

Top Topics

High Spatial Resolution

Evaluation Criteria

Optimization Model

Top Venues

Microelectron. Reliab.

Publications

F. Schindler-Saefkow, F. Rost, A. Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, J. Keller
Stress impact of moisture diffusion measured with the stress chip. Microelectron. Reliab. 54 (6-7) (2014)
Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel
Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectron. Reliab. 54 (9-10) (2014)
Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54 (6-7) (2014)
J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53 (9-11) (2013)
Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel
Studies on the reliability of power packages based on strength and fracture criteria. Microelectron. Reliab. 52 (7) (2012)
O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. Microelectron. Reliab. 52 (7) (2012)
O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel
interface using molecular modelling. Microelectron. Reliab. 51 (6) (2011)
Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectron. Reliab. 50 (7) (2010)
Rainer Dudek, Ralf Döring, Christine Bombach, Bernd Michel
Simulation based analysis of secondary effects on solder fatigue. Microelectron. Reliab. 49 (8) (2009)
Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47 (2-3) (2007)
M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel
Reliability of SnPb and Pb-free flip-chips under different test conditions. Microelectron. Reliab. 47 (2-3) (2007)
Bernhard Wunderle, Bernd Michel
Progress in reliability research in the micro and nano region. Microelectron. Reliab. 46 (9-11) (2006)
Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl
Parametric FE-approach to flip-chip reliability under various loading conditions. Microelectron. Reliab. 44 (12) (2004)
Ulrich Wagner, J. Franz, M. Schweiker, Winfried Bernhard, Roland Müller-Fiedler, Bernd Michel, Oliver Paul
Mechanical Reliability of MEMS-structures under shock load. Microelectron. Reliab. 41 (9-10) (2001)