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O. Bochow-Neß
Publication Activity (10 Years)
Years Active: 2014-2014
Publications (10 Years): 0
Top Topics
Mobile Phone
Design Process
Optimization Methods
Risk Assessment
Top Venues
Microelectron. Reliab.
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Publications
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Jürgen Auersperg
,
Rainer Dudek
,
R. Jordan
,
O. Bochow-Neß
,
Sven Rzepka
,
Bernd Michel
On the crack and delamination risk optimization of a Si-interposer for LED packaging.
Microelectron. Reliab.
54 (6-7) (2014)