Bernhard Wunderle

Publication Activity (10 Years)

Years Active: 2004-2024
Publications (10 Years): 9

Top Topics

Convolutional Neural Networks

Multi Component

Fiber Bragg Grating

State Estimation

Top Venues

Microelectron. Reliab.

Publications

Marcel Kettelgerdes, Nicolas Sarmiento, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger
Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors. Remote. Sens. 16 (13) (2024)
Marcel Kettelgerdes, Tjorven Hillmann, Thomas Hirmer, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger
Accelerated Real-Life (ARL) Testing and Characterization of Automotive LiDAR Sensors to facilitate the Development and Validation of Enhanced Sensor Models. CoRR (2023)
Marcel Kettelgerdes, Amit Pandey, Denis Unruh, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger
Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN). M2VIP (2023)
Ayda Bouhamed, Nathanael Jöhrmann, Slim Naifar, Benny Böhm, Olav Hellwig, Bernhard Wunderle, Olfa Kanoun
Collaborative Filler Network for Enhancing the Performance of BaTiO3/PDMS Flexible Piezoelectric Polymer Composite Nanogenerators. Sensors 22 (11) (2022)
Peter Meszmer, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R. T. Zahn, Bernhard Wunderle
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy. Microelectron. Reliab. 79 (2017)
E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger
Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectron. Reliab. 79 (2017)
Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, Bernhard Wunderle
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. Microelectron. Reliab. 74 (2017)
Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages. Microelectron. Reliab. 62 (2016)
Jens Bonitz, Simon Bottger, Sascha Hermann, Stefan E. Schulz, Thomas Gessner, Steffen Hartmann, Bernhard Wunderle
Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems. NEMS (2016)
F. Schindler-Saefkow, F. Rost, A. Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, J. Keller
Stress impact of moisture diffusion measured with the stress chip. Microelectron. Reliab. 54 (6-7) (2014)
O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang
interfaces investigated by molecular modeling. Microelectron. Reliab. 53 (8) (2013)
O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. Microelectron. Reliab. 52 (7) (2012)
Christian Wagner, Steffen Hartmann, Bernhard Wunderle, Jörg Schuster, Stefan E. Schulz, Thomas Gessner
Nanomechanics of CNTs for sensor application. SSD (2012)
O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel
interface using molecular modelling. Microelectron. Reliab. 51 (6) (2011)
Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectron. Reliab. 50 (7) (2010)
Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl
3-D thin chip integration technology - from technology development to application. 3DIC (2009)
Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47 (2-3) (2007)
M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel
Reliability of SnPb and Pb-free flip-chips under different test conditions. Microelectron. Reliab. 47 (2-3) (2007)
Bernhard Wunderle, Bernd Michel
Progress in reliability research in the micro and nano region. Microelectron. Reliab. 46 (9-11) (2006)
Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl
Parametric FE-approach to flip-chip reliability under various loading conditions. Microelectron. Reliab. 44 (12) (2004)