Klaus-Dieter Lang

Publication Activity (10 Years)

Years Active: 2013-2021
Publications (10 Years): 8

Top Topics

Multichip Module

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

Piotr Mackowiak, Kolja Erbacher, Manuel Baeuscher, Michael Schiffer, Klaus-Dieter Lang, Martin Schneider-Ramelow, Ha-Duong Ngo
Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor. IEEE SENSORS (2021)
Manuel Baeuscher, Oliver Reinicke, Matthäus Henke, Piotr Mackowiak, Michael Schiffer, Martin Schneider-Ramelow, Klaus-Dieter Lang, Ha-Duong Ngo
Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method. DeSE (2019)
Piotr Mackowiak, Samer Al-Magazachi, Klaus-Dieter Lang, Kolja Erbacher, Manuel Bäuscher, Ha-Duong Ngo, Kai Zoschke, Michael Schiffer
Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. DeSE (2019)
Mohammad Hossein Azhdast, Hans Joachim Eichler, Klaus-Dieter Lang, Veronika Glaw
Optimization Parameters for Laser-induced Forward Transfer of Al and Cu on Si-wafer Substrate. PHOTOPTICS (2018)
A. Middendorf, A. Grams, S. Janzen, Klaus-Dieter Lang, Olaf Wittler
Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography. Microelectron. Reliab. (2017)
Ha-Duong Ngo, Piotr Mackowiak, Niels Grabbert, Thomas Weiland, Xiaodong Hu, Martin Schneider-Ramelow, Oswin Ehrmann, Klaus-Dieter Lang
The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications. ICST (2017)
Michael Krüger, Stefan Straube, Andreas Middendorf, Daniel Hahn, T. Dobs, Klaus-Dieter Lang
Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars. Microelectron. Reliab. 64 (2016)
Ha-Duong Ngo, Biswajit Mukhopadhyay, Piotr Mackowiak, Kevin Kröhnert, Oswin Ehrmann, Klaus-Dieter Lang
A WSi-WSiN-Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems. Micromachines 7 (10) (2016)
Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer, Rolf Aschenbrenner, S. Voges, Tina Thomas, R. Kahle, Klaus-Dieter Lang
From fan-out wafer to fan-out panel level packaging. ECCTD (2015)
Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Klaus-Dieter Lang
Microstructural evolution of ultrasonic-bonded aluminum wires. Microelectron. Reliab. 55 (6) (2015)
Ha-Duong Ngo, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang
Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments. Sensors 15 (8) (2015)
Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Martin Schneider-Ramelow, Klaus-Dieter Lang
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding. Microelectron. Reliab. 55 (9-10) (2015)
David Gross, Sabine Haag, Martin Schneider-Ramelow, Klaus-Dieter Lang
The influence of liners with Ti, Ta or Ru finish on thin Cu films. Microelectron. Reliab. 54 (9-10) (2014)
Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang
Improving the FE simulation of molded packages using warpage measurements. Microelectron. Reliab. 54 (9-10) (2014)
Lars Brusberg, Christian Herbst, Marcel Neitz, Henning Schroder, Klaus-Dieter Lang
Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology. ECOC (2014)
O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang
interfaces investigated by molecular modeling. Microelectron. Reliab. 53 (8) (2013)