Rolf Aschenbrenner

Publication Activity (10 Years)

Years Active: 2002-2015
Publications (10 Years): 0

Top Topics

Frequency Distribution

Levels Of Abstraction

Feature Selection

Top Venues

Publications

Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer, Rolf Aschenbrenner, S. Voges, Tina Thomas, R. Kahle, Klaus-Dieter Lang
From fan-out wafer to fan-out panel level packaging. ECCTD (2015)
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl
High-temperature reliability of Flip Chip assemblies. Microelectron. Reliab. 46 (1) (2006)
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics. BSN (2006)
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl
Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. Microelectron. Reliab. 45 (9-11) (2005)
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric. ISWC (2005)
Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectron. Reliab. 44 (5) (2004)
Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
Long time reliability study of soldered flip chips on flexible substrates. Microelectron. Reliab. 44 (2) (2004)
Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl
Bump formation for flip chip and CSP by solder paste printing. Microelectron. Reliab. 42 (3) (2002)