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Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping.
Dionysios Manessis
Rainer Patzelt
Andreas Ostmann
Rolf Aschenbrenner
Herbert Reichl
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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technical contributions
low power
data processing
ibm zenterprise
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coarse to fine
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