Herbert Reichl

Publication Activity (10 Years)

Years Active: 1999-2011
Publications (10 Years): 0

Publications

Thomas Schreier-Alt, Frank Rehme, Frank Ansorge, Herbert Reichl
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds. Microelectron. Reliab. 51 (3) (2011)
Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectron. Reliab. 50 (7) (2010)
Rene Vieroth, Thomas Löher, Manuel Seckel, Christian Dils, Christine Kallmayer, Andreas Ostmann, Herbert Reichl
Stretchable Circuit Board Technology and Application. ISWC (2009)
Herbert Reichl, Ivan N. Ndip
Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes. MBMV (2009)
M. Niedermayer, C. Richter, J. Hefer, Stephan Guttowski, Herbert Reichl
SENESCOPE: A design tool for cost optimization of wireless sensor nodes. IPSN (2009)
Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl
3-D thin chip integration technology - from technology development to application. 3DIC (2009)
Robert Hahn, Stefan Wagner, Steffen Krumbholz, Herbert Reichl
Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators CoRR (2008)
Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari
Lamination And Microstructuring Technology for a Bio-Cell Multiwell array CoRR (2008)
Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl
Technologies for 3D Heterogeneous Integration CoRR (2008)
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl
High-temperature reliability of Flip Chip assemblies. Microelectron. Reliab. 46 (1) (2006)
Andre Lissner, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl
Vorhersage von magnetischen Kopplungen in Filterschaltungen. EMV (2006)
M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl
Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. IPSN (2006)
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics. BSN (2006)
Stefan-Peter Weber, André Linde, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl
Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV. EMV (2006)
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl
Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. Microelectron. Reliab. 45 (9-11) (2005)
Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl
Characterization of bump arrays at RF/microwave frequencies. Microelectron. Reliab. 45 (3-4) (2005)
A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, Herbert Reichl
parameters. Int. J. Circuit Theory Appl. 33 (6) (2005)
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric. ISWC (2005)
Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectron. Reliab. 44 (5) (2004)
Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl
Parametric FE-approach to flip-chip reliability under various loading conditions. Microelectron. Reliab. 44 (12) (2004)
Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
Long time reliability study of soldered flip chips on flexible substrates. Microelectron. Reliab. 44 (2) (2004)
Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl
Bump formation for flip chip and CSP by solder paste printing. Microelectron. Reliab. 42 (3) (2002)
Robert Hahn, Herbert Reichl
Batteries and Power Supplies for Wearable and Ubiquitous Computing. ISWC (1999)