Armin Klumpp

Publication Activity (10 Years)

Years Active: 2008-2019
Publications (10 Years): 5

Top Topics

Ubiquitous Environments

Gene Expression Datasets

High Frequency Components

Top Venues

Publications

Norman Dodel, Roland Thewes, Anouar Laifi, Dirk Eberhardt, Stefan Keil, Leonhard Sturm, Armin Klumpp, Oliver Freudenberg, Friedel Gerfers, Gerhard Hartwich
A CMOS-Based Electrochemical DNA Hybridization Microarray for Diagnostic Applications with 109 Test Sites. BioCAS (2019)
Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC (2019)
Rita Siris, Jamila Boudaden, Armin Klumpp
Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism. IEEE SENSORS (2017)
Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati
3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC (2016)
Jamila Boudaden, Armin Klumpp, Ignaz Eisele, Christoph Kutter
Smart capacitive CO2 sensor. IEEE SENSORS (2016)
Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc
3D Integration technology: Status and application development. ESSCIRC (2010)
Armin Klumpp, Peter Ramm, Robert Wieland
3D-integration of silicon devices: A key technology for sophisticated products. DATE (2010)
Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm
High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC (2010)
Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland
Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. 3DIC (2010)
Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl
Technologies for 3D Heterogeneous Integration CoRR (2008)