Christof Landesberger

Publication Activity (10 Years)

Years Active: 2007-2019
Publications (10 Years): 2

Top Topics

Integrated Circuit

Top Venues

Publications

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC (2019)
Indranil Bose, Nagarajan Palavesam, Christian Hochreiter, Christof Landesberger, Christoph Kutter
Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process. ESSDERC (2018)
Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn
Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron. Reliab. 47 (2-3) (2007)