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Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process.
Indranil Bose
Nagarajan Palavesam
Christian Hochreiter
Christof Landesberger
Christoph Kutter
Published in:
ESSDERC (2018)
Keyphrases
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decision making
general purpose
high speed
data structure
integrated circuit
real time
neural network
machine learning
genetic algorithm
image processing
expert systems
lightweight
hardware implementation
hybrid learning
business process management