Andy Heinig

Publication Activity (10 Years)

Years Active: 2006-2020
Publications (10 Years): 5

Top Topics

Autoepistemic Logic

Success Or Failure

Ibm Power Processor

Top Venues

Publications

Muhammad Waqas Chaudhary, Andy Heinig, Bhaskar Choubey
13-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard. MWSCAS (2020)
Muhammad Waqas Chaudhary, Andy Heinig, Bhaskar Choubey
Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces. ICECS (2020)
Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC (2019)
Muhammad Waqas Chaudhary, Andy Heinig, Michael Dittrich
Interposer based integration to achieve high speed interfaces for ADC application. 3DIC (2016)
Muhammad Waqas Chaudhary, Andy Heinig
Co-design of CML IO and Interposer channel for low area and power signaling. DDECS (2016)
Andy Heinig, Robert Fischbach
Enabling automatic system design optimization through Assembly Design Kits. 3DIC (2015)
Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber
Current and future 3D activities at Fraunhofer. 3DIC (2015)
Andy Heinig, Manfred Dietrich, Andreas Herkersdorf, Felix Miller, Thomas Wild, Kai Hahn, Armin Grünewald, Rainer Brück, Steffen Krohnert, Jochen Reisinger
System integration - The bridge between More than Moore and More Moore. DATE (2014)
Robert Fischbach, Michael Dittrich, Andy Heinig
Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache. MBMV (2014)
Robert Fischbach, Andy Heinig, Peter Schneider
Design rule check and layout versus schematic for 3D integration and advanced packaging. 3DIC (2014)
Susann Wolf, Andy Heinig, Uwe Knöchel
XML-Based Hierarchical Description of 3D Systems and SIP. IEEE Des. Test 30 (3) (2013)
Andy Heinig
Layout dependent synthesis for manufacturing costs optimized 3D integrated systems. 3DIC (2013)
Andy Heinig, Christoph Sohrmann
Multi-step approach for thermal optimization of 3D-IC and package. 3DIC (2011)
Peter Schneider, Andy Heinig, Robert Fischbach, Jens Lienig, Sven Reitz, Jörn Stolle, Andreas Wilde
Integration of multi physics modeling of 3D stacks into modern 3D data structures. 3DIC (2010)
Andy Heinig, Mario Schölzel
Zeitbeschränkte Clusterung zur Design-Space-Exploration geclusterter VLIW-Prozessoren. MBMV (2006)