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Multi-step approach for thermal optimization of 3D-IC and package.

Andy HeinigChristoph Sohrmann
Published in: 3DIC (2011)
Keyphrases
  • multi step
  • single step
  • lower bounding
  • optimization problems
  • k nearest neighbor
  • optimization algorithm
  • evolutionary algorithm
  • knn
  • global optimization
  • integrated circuit
  • active learning
  • multi objective
  • infrared