Peter Ramm

Publication Activity (10 Years)

Years Active: 2008-2019
Publications (10 Years): 4

Top Topics

Activity Recognition

High Frequency Components

Wearable Sensors

Top Venues

Publications

Abhishek Singh Dahiya, Jerome Thireau, Jamila Boudaden, Swatchith Lal, Umair Gulzar, Yan Zhang, Thierry Gil, Nadine Azémard, Peter Ramm, Tim Kiessling, Cian O'Murchu, Fredrik Sebelius, Jonas Tilly, Colm Glynn, Shane Geary, Colm O'Dwyer, Kafil Razeeb, Alain Lacampagne, Benoît Charlot, Aida Todri-Sanial
Energy Autonomous Wearable Sensors for Smart Healthcare: A Review. CoRR (2019)
Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC (2019)
Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati
3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC (2016)
Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber
Current and future 3D activities at Fraunhofer. 3DIC (2015)
Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc
3D Integration technology: Status and application development. ESSCIRC (2010)
Armin Klumpp, Peter Ramm, Robert Wieland
3D-integration of silicon devices: A key technology for sophisticated products. DATE (2010)
Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm
High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC (2010)
E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer
Through Silicon Vias as Enablers for 3D Systems CoRR (2008)
Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl
Technologies for 3D Heterogeneous Integration CoRR (2008)