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High performance 3D interconnects based on electrochemical etch and liquid metal fill.
Harry Hedler
Thomas Scheiter
Markus Schieber
Armin Klumpp
Peter Ramm
Published in:
3DIC (2010)
Keyphrases
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input output
mass transfer
mathematical model
data sets
manufacturing process
database
real time
databases
cost effective
grain size
high temperature
markov chain
boundary conditions
high reliability
power dissipation
fluidized bed