3D TSV based high frequency components for RF IC and RF MEMS applications.

Montserrat Fernandez-Bolaños Wolfgang A. Vitale Mariazel Maqueda Lopez Adrian M. Ionescu Armin Klumpp Karl-Reinhard Merkel Josef Weber Peter Ramm Ilja Ocket Walter De Raedt Amin Enayati

Published in: 3DIC (2016)

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