3-D thin chip integration technology - from technology development to application.
Thomas FritzschRaul MrosskoTobias BaumgartnerMichael ToepperMatthias KleinJürgen WolfBernhard WunderleHerbert ReichlPublished in: 3DIC (2009)
Keyphrases
- case study
- st century
- rapid development
- key technologies
- future trends
- business world
- technical solutions
- cost effective
- seamless integration
- technical issues
- secondary school
- enterprise application
- modular design
- rapid prototyping
- low cost
- object oriented
- e learning
- software engineering
- data processing
- high speed
- knowledge management