Erik Jung

Publication Activity (10 Years)

Years Active: 2007-2019
Publications (10 Years): 3

Top Topics

Swarm Intelligence

Modular Neural Networks

Top Venues

Publications

Erik Jung, Victoria Ly, Adam Buderi, Emma Appleton, Mircea Teodorescu
Design and Selection of Muscle Excitation Patterns for Modeling a Lower Extremity Joint Inspired Tensegrity. IRC (2019)
Erik Jung, Victoria Ly, Nicholas Cessna, Mai Linh Ngo, Dennis Castro, Vytas SunSpiral, Mircea Teodorescu
Bio-Inspired Tensegrity Flexural Joints. ICRA (2018)
Steven Lessard, Jonathan Bruce, Erik Jung, Mircea Teodorescu, Vytas SunSpiral, Adrian K. Agogino
A lightweight, multi-axis compliant tensegrity joint. ICRA (2016)
Steven Lessard, Jonathan Bruce, Erik Jung, Mircea Teodorescu, Vytas SunSpiral, Adrian K. Agogino
A light-weight, multi-axis compliant tensegrity joint. CoRR (2015)
Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari
Lamination And Microstructuring Technology for a Bio-Cell Multiwell array CoRR (2008)
Alberto Fazzi, Roberto Canegallo, Luca Ciccarelli, Luca Magagni, Federico Natali, Erik Jung, Pier Luigi Rolandi, Roberto Guerrieri
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities. IEEE J. Solid State Circuits 43 (1) (2008)
Alberto Fazzi, Roberto Canegallo, Luca Ciccarelli, Luca Magagni, Federico Natali, Erik Jung, Pier Luigi Rolandi, Roberto Guerrieri
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities. ISSCC (2007)
Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. IEEE J. Solid State Circuits 42 (10) (2007)
Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri
3D Capacitive Interconnections for High Speed Interchip Communication. CICC (2007)