Login / Signup

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly.

Alberto FazziLuca MagagniMauro MirandolaBarbara CharletLéa Di CioccioErik JungRoberto CanegalloRoberto Guerrieri
Published in: IEEE J. Solid State Circuits (2007)
Keyphrases
  • levels of abstraction
  • database
  • neural network
  • clustering algorithm
  • decision trees
  • case study