Bump formation for flip chip and CSP by solder paste printing.
Joachim KloeserParadiso CoskinaRolf AschenbrennerHerbert ReichlPublished in: Microelectron. Reliab. (2002)
Keyphrases
- high speed
- low cost
- constraint satisfaction problems
- printed circuit boards
- decomposition methods
- constraint satisfaction
- analog vlsi
- tree decomposition
- mechanical properties
- solving constraint satisfaction problems
- low power
- high temperature
- np hard
- arc consistency
- focal plane
- programmable logic
- sat encodings
- constraint networks
- high density
- tree decompositions
- search space
- real time
- dynamic constraint satisfaction problems
- functional verification
- modular design
- vlsi design
- vlsi implementation
- single chip
- constraint solving
- constraint propagation
- constraint programming
- wireless sensor networks
- lower bound