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From fan-out wafer to fan-out panel level packaging.
Tanja Braun
K.-F. Becker
S. Raatz
V. Bader
Jörg Bauer
Rolf Aschenbrenner
S. Voges
Tina Thomas
R. Kahle
Klaus-Dieter Lang
Published in:
ECCTD (2015)
Keyphrases
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levels of abstraction
image sequences
neural network
real time
databases
machine learning
genetic algorithm
artificial intelligence
information systems
feature selection
learning environment
scheduling problem
higher level
frequency distribution