Kai Zoschke

Publication Activity (10 Years)

Years Active: 2010-2019
Publications (10 Years): 2

Top Topics

Integrated Circuit

Top Venues

Publications

Piotr Mackowiak, Samer Al-Magazachi, Klaus-Dieter Lang, Kolja Erbacher, Manuel Bäuscher, Ha-Duong Ngo, Kai Zoschke, Michael Schiffer
Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. DeSE (2019)
Kai Zoschke, Maurice Güttler, Lars Böttcher, Andreas Grübl, Dan Husmann de Oliveira, Johannes Schemmel, Karlheinz Meier, Oswin Ehrmann
Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster. CoRR (2018)
David Ruffieux, Nicola Scolari, Frédéric Giroud, Thanh-Chau Le, Silvio Dalla Piazza, Felix Staub, Kai Zoschke, Charles Alix Manier, Hermann Oppermann, Tommi Suni, James Dekker, Giorgio Allegato
A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-µW RTC Mode and Programmable HF Clocks. IEEE J. Solid State Circuits 49 (1) (2014)
Rene Puschmann, Mathias Bottcher, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Alix Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, Jürgen Wolf, K. Dieter Lang, Michael Ziesmann
3D integration of standard integrated circuits. 3DIC (2013)
David Ruffieux, Nicola Scolari, Frédéric Giroud, Thanh-Chau Le, Silvio Dalla Piazza, Felix Staub, Kai Zoschke, Charles Alix Manier, Hermann Oppermann, James Dekker, Tommi Suni, Giorgio Allegato
A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. ISSCC (2013)
Robert Wieland, Kai Zoschke, Nils Jurgensen, Karl-Reinhard Merkel, Lars Nebrich, Jürgen Wolf
Silicon-interposer with high density Cu-filled TSVs. 3DIC (2010)