Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.
Piotr MackowiakSamer Al-MagazachiKlaus-Dieter LangKolja ErbacherManuel BäuscherHa-Duong NgoKai ZoschkeMichael SchifferPublished in: DeSE (2019)
Keyphrases
- thin film
- high density
- contact force
- high speed
- room temperature
- solar cell
- micro controller
- grain size
- embedded systems
- short circuit
- low cost
- multi layer
- sensor networks
- image sensor
- real time
- cmos image sensor
- sensor data
- magneto optic
- data mining
- single chip
- electron microscopy
- modular design
- film thickness
- white light interferometry
- data center
- back propagation
- fuzzy logic
- databases