Silicon-interposer with high density Cu-filled TSVs.

Robert Wieland Kai Zoschke Nils Jurgensen Karl-Reinhard Merkel Lars Nebrich Jürgen Wolf

Published in: 3DIC (2010)

Keyphrases

high density
electron microscopy
thin film
low density
close proximity
high power
mechanical properties
magnetic recording
field effect transistors
high bandwidth
data center
plasma etching
general purpose
magnetic tape