Martin Schneider-Ramelow

Publication Activity (10 Years)

Years Active: 2011-2023
Publications (10 Years): 5

Top Topics

Mechanical Properties

Consumer Reviews

Top Venues

Microelectron. Reliab.

Publications

Karsten Schischke, Jana Rückschloss, Moritz-Caspar Schlegel, Jonathan Zöllinger, Nils F. Nissen, Martin Schneider-Ramelow
The European Union's Energy Label for Smartphones: Does it Guide Consumers to Make Environmentally Sustainable Choices? ICCE-Berlin (2023)
Piotr Mackowiak, Kolja Erbacher, Manuel Baeuscher, Michael Schiffer, Klaus-Dieter Lang, Martin Schneider-Ramelow, Ha-Duong Ngo
Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor. IEEE SENSORS (2021)
Manuel Baeuscher, Oliver Reinicke, Matthäus Henke, Piotr Mackowiak, Michael Schiffer, Martin Schneider-Ramelow, Klaus-Dieter Lang, Ha-Duong Ngo
Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method. DeSE (2019)
Ha-Duong Ngo, Piotr Mackowiak, Niels Grabbert, Thomas Weiland, Xiaodong Hu, Martin Schneider-Ramelow, Oswin Ehrmann, Klaus-Dieter Lang
The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications. ICST (2017)
Martin Schneider-Ramelow, Christian Ehrhardt
The reliability of wire bonding using Ag and Al. Microelectron. Reliab. 63 (2016)
Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Martin Schneider-Ramelow, Klaus-Dieter Lang
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding. Microelectron. Reliab. 55 (9-10) (2015)
David Gross, Sabine Haag, Martin Schneider-Ramelow, Klaus-Dieter Lang
The influence of liners with Ti, Ta or Ru finish on thin Cu films. Microelectron. Reliab. 54 (9-10) (2014)
Stefan Schmitz, Martin Schneider-Ramelow, S. Schröder
Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C. Microelectron. Reliab. 51 (1) (2011)