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The reliability of wire bonding using Ag and Al.

Martin Schneider-RamelowChristian Ehrhardt
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • wire bonding
  • stress response
  • real world
  • artificial intelligence
  • reliability analysis
  • databases
  • data mining
  • machine learning
  • case study
  • sufficient conditions
  • dynamic systems
  • failure rate