E. Liu

Publication Activity (10 Years)

Years Active: 1998-2021
Publications (10 Years): 5

Top Topics

Thermal Conductivity

Information System Development

Requirement Analysis

Top Venues

Microelectron. Reliab.

Microelectron. J.

Publications

Younes Benslimane, Z. Yang, E. Liu
Improving Information System Development and Maintainability Factors Through Standardized Processes: An Empirical Study. IEEM (2021)
E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger
Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectron. Reliab. 79 (2017)
Gordon Elger, Dominik Müller, Alexander Hanß, Maximilian Schmid, E. Liu, Udo Karbowski, Robert Derix
Transient thermal analysis for accelerated reliability testing of LEDs. Microelectron. Reliab. 64 (2016)
E. Liu, Alexander Hanss, Maximilian Schmid, Gordon Elger
The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs. Microelectron. Reliab. 67 (2016)
Gordon Elger, Shri Vishnu Kandaswamy, E. Liu, Alexander Hanss, Maximilian Schmid, Robert Derix, Fosca Conti
Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectron. J. 46 (12) (2015)
Ruili Wang, Yulong Zhang, Yi Huang, Fenglan Wei, Xuewei Bai, E. Liu
Effect of burying the straw deeply and plastic mulching on soil water and yield of spring-sown maize. EMEIT (2011)
Ruili Wang, Yulong Zhang, Yi Huang, Fenglan Wei, Xuewei Bai, E. Liu
Mechanization of deep tillage and mulching to improve soil water content and spring maize yield. EMEIT (2011)
E. Liu, C. Wong, Q. Shami, S. Mohapatra, R. Landy, P. Sheldon, G. Woodward
Complete mixed-signal building blocks for single-chip GSM baseband processing. CICC (1998)