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Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations.

Gordon ElgerShri Vishnu KandaswamyE. LiuAlexander HanssMaximilian SchmidRobert DerixFosca Conti
Published in: Microelectron. J. (2015)
Keyphrases
  • finite element
  • finite element analysis
  • high power
  • multiscale
  • artificial neural networks
  • numerical simulations
  • numerical analysis
  • finite element method
  • mesh generation
  • gpu accelerated
  • boundary element