Steffen Wiese

Publication Activity (10 Years)

Years Active: 2004-2018
Publications (10 Years): 2

Top Topics

Printed Circuit Boards

Modular Structure

Top Venues

Microelectron. Reliab.

Publications

Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. Microelectron. Reliab. 91 (2018)
Frank Kraemer, Steffen Wiese
Assessment of long term reliability of photovoltaic glass-glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis. Microelectron. Reliab. 55 (5) (2015)
Frank Kraemer, Steffen Wiese, Erik Peter, Jonas Seib
Mechanical problems of novel back contact solar modules. Microelectron. Reliab. 53 (8) (2013)
Steffen Wiese, Mike Roellig, Maik Mueller, Klaus-Jürgen Wolter
The effect of downscaling the dimensions of solder interconnects on their creep properties. Microelectron. Reliab. 48 (6) (2008)
Steffen Wiese, Klaus-Jürgen Wolter
Creep of thermally aged SnAgCu-solder joints. Microelectron. Reliab. 47 (2-3) (2007)
Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47 (2-3) (2007)
Steffen Wiese, Klaus-Jürgen Wolter
Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectron. Reliab. 44 (12) (2004)
Steffen Wiese, Sven Rzepka
Time-independent elastic-plastic behaviour of solder materials. Microelectron. Reliab. 44 (12) (2004)