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Experimental determination of the Young's modulus of copper and solder materials for electronic packaging.

Frank KraemerMike RoelligRené MetaschJoseph Al AhmarKarsten MeierSteffen Wiese
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • real world
  • experimental data
  • database
  • real time
  • neural network
  • computer vision
  • metadata
  • data structure
  • statistical analysis
  • high density
  • printed circuit boards
  • design automation