J. P. Rebrasse

Publication Activity (10 Years)

Years Active: 2007-2010
Publications (10 Years): 0

Publications

A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectron. Reliab. 50 (9-11) (2010)
A. Aubert, Lionel Dantas de Morais, J. P. Rebrasse
Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. Microelectron. Reliab. 48 (8-9) (2008)
Lionel Dantas de Morais, F. Allanic, F. Roqueta, J. P. Rebrasse
Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. Microelectron. Reliab. 47 (9-11) (2007)
S. Debleds, J. P. Rebrasse, Lionel Dantas de Morais, I. Frapreau, R. Perdreau, B. Morillon
Localization of sensitive areas of power AC switch under thermal laser stimulation. Microelectron. Reliab. 47 (9-11) (2007)