David Bouchu

Publication Activity (10 Years)

Years Active: 2007-2023
Publications (10 Years): 1

Top Topics

Electron Microscopy

Recent Advances

Electrical Properties

Integrated Circuit

Top Venues

Microelectron. Reliab.

Publications

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS (2023)
Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. Microelectron. Reliab. 55 (8) (2015)
Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. 3DIC (2010)
Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC (2009)
Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC (2009)
O. Cueto, Myriam Assous, François de Crecy, A. Toffoli, David Bouchu, M. Fayolle, Frédéric Boulanger
Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects. Microelectron. Reliab. 47 (4-5) (2007)