An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Léa Di CioccioPierric GueguenRachid TaibiThomas SignamarcheixLaurent BallyLaurent VandrouxMarc ZussySophie VerrunJérôme DechampPatrick LeducMyriam AssousDavid BouchuFrançois de CrecyLaurent-Luc ChapelonLaurent ClavelierPublished in: 3DIC (2009)