Aurélie Thuaire

Publication Activity (10 Years)

Years Active: 2010-2013
Publications (10 Years): 0

Top Topics

Electrical Properties

Top Venues

Microelectron. Reliab.

Publications

T. Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, E. Chery, F. Lorut, Lorena Anghel, Gilles Poupon
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53 (1) (2013)
Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. 3DIC (2010)